Technology/Systems

There is a saying in the industry segment that ' Soldering is a simple process if its taken care to its minute detail'
This is the concept behind Tresmine process design and control.

We emphasis more on pre-engineering then re-engineering. So we have Cluso systems - designed and developed in house.
This wonderful system intake inputs like customer supplied BOM (in any format), the CAD data and the machine program. It checks if all customer supplied BOM are in our placement program. It checks if the program placement location matches with the CAD data. If its good, it generates an inspection program for actual board verification. All this is done even before parts are procured for assembly.

We have  ECRA screen printer but it does more than screen printing like AOI inspection of solder paste. It measures volume and location of solderpaste deposited after stencil printing (a must for BGA assembly). Auto alignment (for fine pitch QFP), auto cleaning (for 0201 components) are some of the features.

Similarly we have Juki pick and place lines which are very good for placement accuracy. They have built in lead inspection mechanism (for QFP and BGA) and these placement machines are connected to server for data and program revision control.

Mydata lines have component value measurement before placement a key feature needed for any prototype build.

Lead free reflow oven has 8 chambers with separate top and bottom heating controls (effective 16 chambers) which not only reflows the board to its optimum, but allows our process engineers to set correct profile for any board easily.

We still have earlier reflow oven running under leaded profile requirement for some of the customer specific needs. Leaded and leadfree lines are never mixed at Tresmine for better controls.

We check the first article of every setup using Cluso First article inspector- an inspection not only in comparison with the golden board, but with reference to customer supplied BOM and CAD files.

We have through hole auto insertion machine working well which is a rarity in the low/medium volume segment of this industry.

The wave soldering line is new and is built for lead-free process. The soldering is always in an inert atmosphere (Nitrogen) for a reliable and shiny joint. The dual wave system ensures good fillet and dry joints on SMT components.

We do have  Seho - dual wave soldering machine running under Nitrogen environment and with leaded solder for any customer specific requirement.

Just to complete the process, we do have Sniper BGA rework station which is more of a contingency plan.

We inspect every component and solderjoint on the boards with YES Tech AOI system to assure board quality.

We have designed an inhouse 'visual aid system' to capture any form of knowledge (picture/ words/ drawing etc)  at any point of time. This can be recalled by simply scanning the traveller at later point of time or may be during next run. The salient feature of this system is that this is revision control and data is centrally stored and backed up.

The complete production control system InvMan is designed and developed inhouse. This package has Purchasing, Production and QA modules. This makes us flexible to incorporate any of the customer requirements with ease.

Last but not least, We are always here to serve you better. Competent people are also our asset.