Tresmine Pty Ltd
 
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Environmental Certification | 26-Oct-2011

We are successfully certified under ISO14001 Environmental Management System. This proves our commitment to the land in which we operate...

ISO14001:2004 | 24-May-2011

Tresmine is committed to operate its business in an environmentally responsible manner. As a first step, its implementing ISO14001 standard. This achievemen..

 
 

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Services

Our service capabilities are as below. We undertake any of the below services in a professional way.

Board Assembly:

General: We can process board size at a minimum of 50x30mm to a maximum of 510 x 360mm. Both side SMT and selective through hole soldering with Leaded and Lead-free processes. Its a no-clean process.

SMT: We can mount and reflow chip components from 0201 and above.

BGA: We can mount and  reflow BGAs from 20mil (0.5mm) pitch and above.

QFP: We can mount and reflow fine pitch ICs from 16mil pitch and above.

Wave: Bottom side only. Chip wave can solder chip components on bottom side.

Through hole assembly: Both wave soldering and selective hand soldering.

Testing: Bed of nails testing and functional test with on board or off board IC programming.

Coating: Conformal coating by spray, brush, dip with selective coating option.

Packing: We use ESD foam/ ESD bubble wrap and ESD bags that protect the circuit from Static charge damages.

Shipping: World wide.

Final Assembly/ Box build:


Mechanical assembly:  We can assemble finished units based on the customer supplied information including labeling and packing. We can procure metal work, assemble pcbs in-house and completed units can be shipped to desired destination.

Turnkey manufacturing:


Parts purchasing: We can procure parts on your behalf and stock at Tresmine. Each customer part is considered as unique and not used for any other customer. Traceability, MOQ, lead time benefits are passed on to customers.