PCB Assembly

The key feature of our PCB assembly process is that it is engineered to deliver very high yields from the very first batch. Since with many of our customers sales and consequently production are quite irregular, we can't afford the slow learning curve and gradual process improvement common to most high volume CEM's. As such we rely more on preventive procedures, we use high quality equipment which gives a wider process window and a greater effort is placed on planning. Advanced inspection equipment like "Cluso" is used as a process control and inspection equipment.

Currently Tresmine has on going production of the entire range of SMT devices, from 0201 chip components to BGA's and very fine pitch QFP's. Our soldering processes are Nitrogen based, which again contribute to a higher product reliability.

Most of our production is lead-free assembly and RoHS compliant. The old line still caters to the customer specific leaded requirement.